Microprocessor in the last 10 years

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    From "2 Duo" to "Core i"

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    Nehalem Microarchitecture (1st generation)

    Common features of all Nehalem based processors include an integrated DDR3 memory controller as well as QuickPath Interconnect or PCI Express and Direct Media Interface on the processor replacing the aging quad-pumped Front Side Bus used in all earlier Core processors. All these processors have 256 KB L2 cache per core, plus up to 12 MB shared L3 cache. Because of the new I/O interconnect, chipsets and mainboards from previous generations can no longer be used with Nehalem-based processors.
  • Intel released the Core 2 Duo processor E7500

    (3 M cache, 2.93 GHz, 1066 MHz FSB) on January 18, 2009.
  • Intel released the Core 2 Quad processor Q8400

    (4 M cache, 2.67 GHz, 1333 MHz FSB) in April 2009.
  • Intel released the Core 2 Duo processor E7600

    (3 M cache, 3.06 GHz, 1066 MHz FSB) on May 31, 2009.
  • Intel released the first Core i7 mobile processor, the i7-720QM

    September 2009. It uses the Socket G1 socket type, runs at 1.6 GHZ, and features 6 MB L3 cache.
  • Intel released the first Core i5 desktop processor with four cores, the i5-750

    (8 M cache, 2.67 GHz, 1333 MHz FSB), on September 8, 2009.
  • Intel released the Core 2 Quad processor Q9550s

    (12 M cache, 2.83 GHz, 1333 MHz FSB, 4 Cores, Socket 775) in January 2010.
  • Intel released the first Core i5 mobile processors, the i5-430M and the i5-520E

  • Intel released the first Core i5 desktop processor over 3.0 GHz the i5-650

    January 2010
  • Release of the i3 serie

  • Intel released the first Core i3 desktop processors, the i3-530, and i3-540

    January 7, 2010.
  • Intel released the first Core i3 mobile processors, the i3-330M

    (3 M cache, 2.13 GHz, 1066 MHz FSB) and the i3-350M, on January 7, 2010.
  • Intel released the first Core i7 desktop processor with six cores, the i3-970

    July 2010. It runs at 3.2 GHz and features 12 MB L3 cache.
  • Intel released seven new Core i5 processors with four cores, the i5-2xxx series.

    January 2011
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    Sandy Bridge microarchitecture (2nd generation)

    This is the second generation of the Core processor microarchitecture. It kept all the existing brands from Nehalem, including Core i3/i5/i7, and introduced new model numbers. The initial set of Sandy Bridge processors includes dual- and quad-core variants, all of which use a single 32 nm die for both the CPU and integrated GPU cores, unlike the earlier microarchitectures.
  • Intel released the 2nd generation of i3 processor

    The Core i3-2xxx line of desktop and mobile processors is a direct replacement of the 2010 "Clarkdale" Core i3-5xx and "Arrandale" Core i3-3xxM models, based on the new microarchitecture. While they require new sockets and chipsets, the user-visible features of the Core i3 are largely unchanged, including the lack of support for Turbo Boost and AES-NI. Unlike the Sandy Bridge-based Celeron and Pentium processors, the Core i3 line does support the new Advanced Vector Extensions.
  • Intel released the 2nd generation of i5 processor

    The Core i5-2xxx line of desktop processors are mostly quad-core chips, with the exception of the dual-core Core i5-2390T, and include integrated graphics, combining the key features of the earlier Core i5-6xx and Core i5-7xx lines. The suffix after the four-digit model number designates unlocked multiplier (K), low-power (S) and ultra-low-power (T).
    The i5-2xxxM processors are all dual-core and hyper-threaded chips like the previous Core i5-5xxM series, and share most of the features.
  • Intel released the 2nd generation of i7 processor

    Its Sandy Bridge models feature the largest amount of L3 cache and the highest clock frequency. Most of these models are very similar to their smaller Core i5 siblings. The quad-core mobile Core i7-2xxxQM/XM processors follow the previous "Clarksfield" Core i7-xxxQM/XM processors, but now also include integrated graphics.
  • Intel released the 3rd generation of i3 processor

    The Ivy Bridge-based Core-i3-3xxx line is a minor upgrade to 22 nm process technology and better graphics.
  • Intel released the 3rd generation of the "Core i" processor family

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    Ivy Bridge microarchitecture (3rd generation)

    Ivy Bridge is the codename for a "third generation" line of processors based on the 22 nm manufacturing process developed by Intel
  • AMD releases the first desktop processors in the A10 Line

    They did two models, the A10 - 5700 and the A10 - 5800B with the following specs: 3.8GHz / 4MB L2 / 4 cores / Socket FM2
  • Intel released the 4rd generation of the "Core i" processor family

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    Haswell microarchitecture (4th generation)

  • AMD released Athlon II X2 280

    One of their fastest processors to date. It has 2 cores and runs at 3.6 GHz
  • Intel released ther first processor using a BGA - 1364 socket

    It features an Iris Pro Graphics GPU 5200. Runs at 3.2 GHz and has a 6 MB L3 cache
  • AMD released their first APU Pro A series processor

    The A6 Pro-7050B, A8 Pro-7150B and the A10 Pro-7350B . The y have one or two cores and run from 1.9 GHz to 2.2 GHz
  • Intel released the 5th generation of the "Core i" processor family

    Broadwell is the fifth generation Core processor microarchitecture, and was released by Intel on September 6, 2014, and began shipping in late 2014. It is the first to use a 14 nm chip. Additionally, mobile processors were launched in January 2015 and Desktop Core i5 and i7 processors were released in June 2015.
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    Broadwell microarchitecture (5th generation)

    It is the first to use a 14 nm chip
  • Intel released the 6th generation of the "Core i" processor family

    Skylake is the sixth generation Core processor microarchitecture, and was launched in August 2015. Being the successor to the Broadwell line, it is a redesign using the same 14 nm manufacturing process technology; however the redesign has better CPU and GPU performance and reduced power consumption. Intel also disabled overclocking non -K processors.
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    Skylake microarchitecture (6th generation)

    Being the successor to the Broadwell line, it is a redesign using the same 14 nm manufacturing process technology; however the redesign has better CPU and GPU performance and reduced power consumption. Intel also disabled overclocking non -K processors.
  • Intel releases a Core i7 refresh

    The intel Core i7 - 6700 has 3.4 GHz, 8MB L3, 4 cores and an 1151 socket
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    Kaby Lake microarchitecture (7th generation)

    Similar to Skylake, Kaby Lake processors are produced using a 14 nanometer manufacturing process technology.
  • AMD released their first Ryzen 7 processors

    the 1700, 1700X, and 1800X models (eight cores, run at 3.0 to 3.6 GHz) also they featured a 16Mb L3 Cache.
  • Intel released the first Core i9 desktop processor

    the i9-7900X uses the LGA 2066 socket, runs at 3.3 GHZ, has 10 cores, and features 13.75 MB L3 cache.
  • Intel released the first desktop processor with 18 cores

    the Core i9-7980X, runs at 2.6 GHZ and features 24.75 MB L3 cache.
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    Coffee Lake microarchitecture (8th/9th generation)

    For the first time in the ten year history of Intel Core processors, the Coffee Lake generation features an increase in core counts across the desktop lineup of processors, a significant driver of improved performance versus previous generations despite similar per-clock performance.
  • Intel released the first Core i9 mobile processor

    the i9-8950HK, It uses the BGA 1440 socket, runs at 2.9 GHZ, has six cores, and features 12 MB L3 cache.
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    Cannon Lake microarchitecture (9th generation)

    Cannon Lake (formerly Skymont) is Intel's codename for the 10-nanometer die shrink of the Kaby Lake microarchitecture.
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    Ice Lake microarchitecture (10th generation)

    Ice Lake is codename for Intel's 10th generation microarchitecture, representing an enhancement of the 'Architecture' of the preceding generation Kaby Lake/Cannon Lake processors (as specified in Intel's process–architecture–optimization execution plan). With Cannon Lake having successfully moved from a 14 nm to 10 nm manufacturing process, Ice Lake is also expected to feature an enhanced 10 nm process (10 nm+).