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First Generation of Computers (1946-1959):
*Used vacuum tubes for memory and circuitry.
*Vacuum tubes controlled electric current in a high vacuum.
**Characteristics:
*Large and expensive.
*High electricity consumption.
*Generated significant heat.
*Prone to malfunctions.
**Programming*:
*Used machine language.
*Capable of solving one problem at a time. -
Second Generation Computers (1957-1963):
Transitioned from vacuum tubes to transistors.
Transistors: Efficient for signal switching.
Invented in 1947.
Benefits of transistors: Smaller, cheaper, faster, and more reliable.
Magnetic cores introduced for memory:
Invented by Jay Forrester at MIT in 1949.
Faster and more durable, introduced RAM.
Programming: Shifted to assembly language for easier programming, but computer-specific. -
Third Generation Computers (1958-1971):
Integrated Circuits (ICs): Replaced transistors, developed in 1958.
Advantages: Enhanced reliability, speed, portability, and cost-efficiency.
Programming Languages: Introduced BASIC, PASCAL, COBOL, FORTRAN-II, and more.
Speed and Efficiency: Reduced computational time significantly.
Magnetic Storage: Gained popularity.
Operating Systems: Introduced time-sharing and multiprogramming. -
Fourth Generation Computers (1971-1980):
VLSI Circuits: Used Very Large Scale Integrated (VLSI) tech, combining thousands of circuits on one chip.
Microcomputers: Affordable, boosting PC usage.
Size & Cost: Compact, reliable, cost-effective; popularized handheld computers.
Networking: Invented and widely adopted.
High-Level Languages: Employed languages like C, C++, DBASE, etc.
Time Sharing & Real-Time Networks: Introduced time-sharing, real-time networks, and distributed systems. -
Fifth Generation Computers (Ongoing):
ULSI Technology: Yields microprocessors with 10M components.
AI Focus: Enables human-like behavior.
Input/Output Devices: Utilizes various devices.
Portability & Size: Compact, including smartphones.
Parallel Processing: Built on parallel processing.
Note: Still in development. -
7th Gen Intel Processor (Kaby Lake): Announced on August 30, 2016.
A refresh of Skylake architecture with power improvements.
Uses 14-nm process architecture.
Features: Advanced semiconductor tech, improved clock speeds, power efficiency, enhanced graphics.
Example: Intel Core i7-7560U (2 cores, max turbo 3.80 GHz) and i7-7567U (2 cores, max turbo 4.00 GHz).
Note: Information may change without notice; Intel can alter manufacturing, specs, and product descriptions. -
8th Gen Intel Processor: Second 14 nm process node refinement.
Features: Advanced semiconductor tech, improved clock speeds, power efficiency, enhanced graphics.
Example: Intel Core i5-8265U (4 cores, max turbo 3.90 GHz) and i5-8365U (4 cores, max turbo 4.10 GHz).
Note: Information may change without notice; Intel can alter manufacturing, specs, and product descriptions. -
9th Gen Intel Processor (Coffee Lake Refresh): Announced on August 21, 2017.
Manufactured using Intel's second 14 nm process node refinement.
Features: Advanced semiconductor tech, improved clock speeds, power efficiency, enhanced graphics.
Example: Intel Core i9-9900KS (8 cores, max turbo 5.00 GHz) and i9-9880H (8 cores, max turbo 4.80 GHz).
Note: Information may change without notice; Intel can alter manufacturing, specs, and product descriptions. -
10th Gen Intel Processor (Comet Lake): Announced on August 21, 2019.
Manufactured using Intel's third 14 nm Skylake process revision.
Features: Advanced semiconductor tech, improved clock speeds, power efficiency, enhanced graphics.
Example: Intel Core i7-10870H (8 cores, max turbo 5.00 GHz) and i7-10810U (6 cores, max turbo 4.90 GHz). -
11th Gen Intel Processor (Rocket Lake): Released on March 30, 2021.
Cypress Cove microarchitecture (backported from 10nm to 14nm).
Features: Advanced semiconductor tech, improved clock speeds, power efficiency, enhanced graphics.
Example: Intel Core i9-11900H (8 cores, max turbo 4.90 GHz) and i9-11950H (8 cores, max turbo 5.00 GHz).
Note: Information may change without notice; Intel can alter manufacturing, specs, and product descriptions. -
12th Gen Intel (Alder Lake)Announced Oct 27, 2021.
Hybrid architecture (Golden Cove, Gracemont cores).
Fabricated on Intel 7 process (formerly 10 nm Enhanced SuperFin).
Key features: Advanced tech, improved speeds, power efficiency, better graphics.
Example: Intel Core i9-12900K, 16 cores, 24 threads, "world's fastest gaming processor."
Offers 13% gaming boost, outperforms AMD Ryzen 9 5950X by up to 30% in gaming, and doubles content creation performance compared to its predecessor. -
6th Gen computers: Late 20th to early 21st century.
Key features: Internet adaptation, multitasking microprocessors, memory advancements, personal devices.
Future expectations: Widespread AI, smarter smartphones, improved social media, privacy emphasis, evolving PC storage.